Semiconductor device

ABSTRACT

Provided are a power device, a sensor which measures a physical state of the power device to transmit a signal according to the physical state, a main electrode terminal through which a main current of the power device flows, a sensor signal terminal which is connected to the sensor to receive a signal from the sensor, a driving terminal which receives driving power for driving the power device, and an open bottomed case which houses the power device, the sensor, the main electrode terminal, the sensor signal terminal and the driving terminal, the sensor signal terminal and the driving terminal each having a first terminal and a second terminal which are provided away from an inner side wall surface of the case, the first and second terminals electrically conducting to each other to form a double structure.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a semiconductor device, andparticularly, to a power semiconductor device.

Description of the Background Art

In general, an intelligent power module (IPM) is mounted with a powerdevice such as an insulated gate bipolar transistor (IGBT), ametal-oxide-semiconductor field-effect transistor (MOSFET), a freewheeling diode (FWD) or the like, as well as having a function ofcontrolling drive of a power device. Further, an IPM has various sensorswhich detect temperature, a current value or the like of a power deviceand transmit these pieces of information as signals, and has a functionof protecting the power device from overheat, overcurrent or the like byusing a signal transmitted from each sensor. An IPM thus provided with afunction of controlling drive of a power device and a function ofprotecting the device is packaged and is used for an inverse conversionunit or the like of an inverter device as disclosed in, for example,Japanese Patent Application Laid-Open No. 6-303778 (Patent Document 1).

As disclosed in Patent Document 1, in a conventional IPM, a powerdevice, a sensor unit, a control circuit for drive of a power device anda control circuit for protection operation are housed in a package.Therefore, at the time of changing a specification for control of driveor protection operation, not only design change of the IPM as a wholebut also when the IPM is configured as an IGBT module or a MOStransistor module other than an IPM, drastic design change thereof isrequired to cause a problem of an increase in manufacturing cost.

SUMMARY OF THE INVENTION

An object is to provide a semiconductor device enabling a kind of moduleto be changed with ease.

A semiconductor device according to the present invention includes apower device, a sensor which measures a physical state of the powerdevice to transmit a signal according to the physical state, a mainelectrode terminal through which a main current of the power deviceflows, a sensor signal terminal which is connected to the sensor toreceive a signal from the sensor, a driving terminal which receivesdriving power for driving the power device, and an open bottomed casewhich houses the power device, the sensor, the main electrode terminal,the sensor signal terminal and the driving terminal, in which the sensorsignal terminal and the driving terminal each have a first terminal anda second terminal provided away from an inner side wall surface of thecase, the first and second terminals electrically conducting to eachother to form a double structure.

Since the first and second terminals electrically conduct to each otherto form a double structure, at the time of changing a kind of module,the semiconductor device according to the present invention only needsto use either one of the first and second terminals according to thekind of module, so that parts can be used in common to enable reductionin manufacturing cost.

These and other objects, features, aspects and advantages of the presentinvention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded view showing a configuration of an IPM forexplaining a presupposed technique of the present invention;

FIG. 2 is a sectional view showing a configuration of an IPM forexplaining the presupposed technique of the present invention;

FIG. 3 is an exploded perspective view showing a more specificconfiguration of the IPM for explaining the presupposed technique of thepresent invention;

FIG. 4 is a sectional view showing a configuration of an IGBT module forexplaining the presupposed technique of the present invention;

FIG. 5 is a sectional view showing a core block used in common amongdifferent modules;

FIG. 6 is a sectional view showing an IPM configured using the commonlyused core block;

FIG. 7 is a plan view of a user PCB seen from above;

FIG. 8 is a sectional view showing a configuration of a core block of afirst preferred embodiment according to the present invention;

FIG. 9 is a sectional view showing an IGBT module configured using thecore block of the first preferred embodiment according to the presentinvention;

FIG. 10 is a sectional view showing an IPM configured using the coreblock of the first preferred embodiment according to the presentinvention;

FIG. 11 is a plan view of a user PCB seen from above;

FIG. 12 is a sectional view showing a configuration of a core block of asecond preferred embodiment according to the present invention;

FIG. 13 is a sectional view showing a configuration of a core block ofthe second preferred embodiment according to the present invention;

FIG. 14 is a sectional view showing a configuration of a core block ofthe second preferred embodiment according to the present invention;

FIG. 15 is a perspective view showing a configuration of a terminalengaging portion and a relay terminal;

FIG. 16 is a sectional view showing an IPM configured using the coreblock of the second preferred embodiment according to the presentinvention;

FIG. 17 is a sectional view showing a configuration of an IGBT module ofa third preferred embodiment according to the present invention;

FIG. 18 is a sectional view showing a configuration of an IPM of thethird preferred embodiment according to the present invention;

FIG. 19 is a sectional view showing a configuration in which a case isfilled with a resin material;

FIG. 20 is a sectional view showing a configuration in which the case isfilled with a resin material;

FIG. 21 is a sectional view showing a configuration in which the case isfilled with a resin material and an opening portion of the case iscovered with a lid;

FIG. 22 is a sectional view showing a configuration in which the case isfilled with a resin material and the opening portion of the case iscovered with the lid;

FIG. 23 is a sectional view showing a configuration of the lid whichcovers the opening portion of the case; and

FIG. 24 is a view showing a configuration of a press-fit terminal.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Introduction

Prior to description of preferred embodiments, a presupposed techniqueof the present invention will be described. FIG. 1 is an exploded viewshowing a configuration of an IPM 70 as a presupposed technique of thepresent invention and is a sectional view schematically showing aconfiguration of a core block 30 and a control substrate 32. Core blockis a generic name of a module configured with semiconductor devicesincluding a power device, a case accommodating the semiconductor device,and the like.

As shown in FIG. 1, in the core block 30, a case 36 formed of aninsulating material such as resin is arranged on a base plate 34 made ofmetal or the like. Inside the case 36, a wiring pattern 38 is bonded onthe base plate 34 via, for example, a solder 40. On an upper surface ofthe wiring pattern 38, an insulating substrate 42 is arranged. A wiringpattern 44 is arranged on an upper surface of the insulating substrate42, and a power device 46 and a sensor 47 are bonded on an upper surfaceof the wiring pattern 44 by a solder 48. The sensor 47 measures suchphysical states of the power device as a signal according to atemperature of the power device and a signal according to a currentflowing in the power device 46 and transmits a signal according to aphysical state. The wiring patterns 38 and 44 are formed by directlybonding a copper pattern on the insulating substrate 42 formed ofalumina ceramics or the like by, for example, a direct copper bond (DCB)method.

Inside the case 36, a sensor signal terminal 200 and a driving terminal220, and a main electrode terminal 56 are arranged outside theinsulating substrate 42. Between the sensor signal terminal 200, thedriving terminal 220 and the main electrode terminal 56, and theinsulating substrate 42, a fixed space is provided. Here, although aplurality of the sensor signal terminals 200, the driving terminals 220and the main electrode terminals 56 are provided, the respectiveterminals are each illustrated as one terminal in FIG. 1 because ofoverlapping.

The sensor signal terminal 200 is connected to the sensor 47 to receivea signal from the sensor 47. The driving terminal 220 externallyreceives driving power for driving the power device 46 and supplies thesame to the power device 46. Additionally, the main electrode terminal56 is a terminal through which a main current of the power device 46flows, and the power device 46 and the main electrode terminal 56 areconnected by a bonding wire for power wiring 58. Additionally, the powerdevice 46 is connected to the sensor signal terminal 200 and the drivingterminal 220 by a bonding wire for signal wiring 60.

The control substrate 32 includes a printed board 62 on which a circuitpattern not shown, and an integrated circuit 66 and a control circuit 68connected to each other by the circuit pattern are provided to controldrive of the power device 46 and to control protection operation of thepower device 46 in response to a signal output by the sensor 47.Additionally, on the printed board 62, an external input/output terminal64 is provided.

The control substrate 32 is inserted into the case 36 from an openingportion of the case 36, and the sensor signal terminal 200 and thedriving terminal 220 are inserted into a through hole (not shown)provided in the printed board 62 and then bonded, thereby connecting thecore block 30 and the control substrate 32 to configure the IPM 70. As amethod of bonding the sensor signal terminal 200 and the drivingterminal 220 with the control substrate 32, soldering, connection by aconnector, ultrasonic bonding and welding can be used.

Thereafter, feeding a resin material from the opening portion of thecase 36 to cover the insulating substrate 42, the power device 46mounted on the insulating substrate 42 and the like with a resin RS andcovering the opening portion of the case 36 with a lid 72 results inobtaining the IPM 70 as shown in FIG. 2. The lid 72 is provided with athrough hole (not shown) though which a front end portion of theexternal input/output terminal 64 on the control substrate 32 isinserted, so that the front end portion of the external input/outputterminal 64 externally protrudes via the through hole.

FIG. 3 is an exploded perspective view showing one example of a morespecific configuration of the IPM 70 shown in FIG. 2. As shown in FIG.3, at the top of the core block 30, the control substrate 32 isarranged, and the core block 30 and the control substrate 32 areconnected via the sensor signal terminal 200 and the driving terminal220. Further, at the top of the control substrate 32, the lid 72 isarranged. The main electrode terminal 56 is embedded in a wall surfaceof the case 36 and has a front end portion externally protruding from anend surface of the wall surface of the case 36.

As described in the foregoing, in the IPM 70, the core block 30 and thecontrol substrate 32 are separately configured, and the controlsubstrate 32 can be independently designed. Therefore, at the time ofchanging a specification of driving and protection operation, change ofonly the control substrate 32 is required, which makes a specificationchange easier as compared with a case where design change of the entireIPM is made at the time of changing a specification. Additionally,separate provision of the control substrate 32 enables standardizationof the core block 30 to enable reduction in a development period.

Additionally, while the configuration of the IPM 70 has been describedin the foregoing, the core block 30 can be used also as a simple IGBTmodule or MOS transistor module without having the control substrate 32.FIG. 4 is a sectional view showing an IGBT module 80 configured usingthe core block 30. In FIG. 4, the same components as those of the IPM 70described with reference to FIG. 2 are given the same reference codes toomit description of an overlapping part.

As shown in FIG. 4, in the IGBT module 80, the sensor signal terminal200 and the driving terminal 220 are each embedded in the wall surfaceof the case 36 and have a front end portion externally protruding fromthe end surface of the wall surface of the case 36 similarly to the mainelectrode terminal 56.

Thus, although the IGBT module and the MOS transistor module can beconfigured using the core block 30, the IPM 70 and the IGBT module 80are not allowed to use the core block 30 in common.

The inventors have therefore developed a core block 301 as shown in FIG.5 as a configuration which allows an IPM, an IGBT module and a MOStransistor module to use a core block in common.

FIG. 5 is a sectional view showing an IGBT module 801 configured usingthe core block 301. In FIG. 5, the same components as those of the IPM70 described with reference to FIG. 2 are given the same reference codesto omit description of an overlapping part.

As shown in FIG. 5, in the IGBT module 801, both of the sensor signalterminal 200 and the driving terminal 220 have a double structure whichhas an external connection terminal OT embedded in a side wall of thecase 36 and having a front end portion externally protruding from theend surface of the wall surface of the case 36 and a relay terminal RTnot embedded in the side wall of the case 36 and having a front endportion not externally protruding from the case 36. Specifically, theexternal connection terminal OT and the relay terminal RT are configuredto have a common terminal pad TP to be electrically conducted with eachother. Accordingly, when the IGBT module 801 is configured using thecore block 301, a driving power signal and a signal can be input/outputto/from the outside using the external connection terminal OT. Bycontrast, since the relay terminal RT is housed in the case 36, coveringthe opening portion of the case 36 with the lid 72 prevents the relayterminal RT from coming into contact with the outside.

While FIG. 5 shows a case where the main electrode terminal 56 embeddedin the side wall of the case 36, and the external connection terminal OTand the relay terminal RT are configured to be a press-fit terminal, theterminals may be configured to be a solder terminal.

FIG. 6 is a sectional view showing an IPM 701 configured using the coreblock 301. In FIG. 6, the same components as those of the IPM 70described with reference to FIG. 2 are given the same reference codes toomit description of an overlapping part.

As shown in FIG. 6, in the IPM 701, the relay terminals RT of the sensorsignal terminal 200 and the driving terminal 220 are inserted intothrough holes (not shown) provided in the printed board 62 and thenbonded, thereby connecting the core block 301 and the control substrate32 to have the front end portion of the external input/output terminal64 provided on the control substrate 32 so as to externally protrude viaa through hole (not shown) provided in the lid 72.

Here, on the top of the IPM 701, a user printed circuit board (PCB) 51is mounted, and the front end portion of the external input/outputterminal 64 and a front end portion of the main electrode terminal 56are inserted into through holes (not shown) of the user PCB 51 andbonded, thereby connecting the IPM 701 and the user PCB 51.

Although the control substrate 32 of the IPM 701 has a control circuitfor driving a power device and a control circuit for protectionoperation to control driving of the power device and control protectionoperation of the power device according to a signal output by the sensor47, since such electric parts as a signal circuit (photo-coupler etc.),a power source circuit and a memory control unit (MCU) for operating theIPM are not mounted on the control substrate 32, a user of the IPM 701is to design these circuits according a desired specification and mountthe same on the user PCB 51.

The problem here is presence of the external connection terminal OTwhose front end portion externally protrudes from the end surface of thewall surface of the case 36. Since the external connection terminal OTis electrically conducted with the relay terminal RT, it is notdesirable that the front end portion thereof is in contact with anelectric part on the user PCB 51. Therefore, the external connectionterminal OT is also configured to have the front end portion insertedinto the through hole (not shown) provided in the user PCB 51 and thenbonded. As a matter of course, the through hole into which the front endportion of the external connection terminal OT is inserted is in contactneither with each other nor with an electric part on the user PCB 51.

FIG. 7 shows a plan view of the user PCB 51 seen from above. As shown inFIG. 7, the user PCB 51 is provided with a through hole TH1 providedcorresponding to an arrangement position of the external input/outputterminal 64, a through hole TH2 provided corresponding to an arrangementposition of the main electrode terminal 56, and a through hole TH3provided corresponding to an arrangement position of the externalconnection terminal OT. The through holes TH1 to TH3 each include aplurality of holes provided in line.

In such a configuration, for electrically connecting an electric partprovided at an outer side (the side not at the top of the IPM 701) ofthe arrangement of the through holes TH3 with, for example, the throughhole TH1, a wiring pattern PP detouring the arrangement of the throughholes TH3 should be provided, so that it is highly probable thatflexibility in design of the user PCB 51 such as insulation design,pattern design or the like is deteriorated. The inventors therefore havedeveloped a core block further easier to handle as the presentinvention. In the following, preferred embodiments according to thepresent invention will be described.

First Preferred Embodiment

FIG. 8 is a sectional view showing a configuration of a core block 100of a first preferred embodiment according to the present invention. InFIG. 8, the same components as those of the IPM 70 described withreference to FIG. 2 are given the same reference codes to omitdescription of an overlapping part.

As show in FIG. 8, in the core block 100, both of a sensor signalterminal 200 and a driving terminal 220 have a double structure whichhas an external connection terminal OT1 (first terminal) provided awayfrom an inner side wall surface of a case 36 and having a front endportion externally protruding from the case 36, and a relay terminal RT1(second terminal) having a front end portion not externally protrudingfrom the case 36. Specifically, the external connection terminal OT1 andthe relay terminal RT1 are configured to have a common terminal pad TPand to be electrically conducted with each other. Accordingly, when anIGBT module or a MOS transistor module is configured using the coreblock 100, driving power and a signal can be input/output to/from theoutside using the external connection terminal OT1.

FIG. 9 is a sectional view showing an IGBT module 800 configured usingthe core block 100. As shown in FIG. 9, in the IGBT module 800, drivingpower and a signal are input/output to/from the outside using theexternal connection terminal OT1.

By contrast, since the relay terminal RT1 is housed in the case 36,covering an opening portion of the case 36 with a lid 72 makes itpossible to obtain an IGBT module with ease without having the relayterminal RT1 in contact with the outside.

FIG. 10 is a sectional view showing an IPM 700 configured using the coreblock 100. In FIG. 10, the same components as those of the IPM 701described with reference to FIG. 6 are given the same reference codes toomit description of an overlapping part.

As shown in FIG. 10, in the IPM 700, the relay terminals RT1 of thesensor signal terminal 200 and the driving terminal 220 are insertedinto through holes (not shown) provided in a printed board 62 and thenbonded, thereby connecting the core block 100 and a control substrate 32to input/output driving power and a signal to/from the control substrate32. Additionally, a front end portion of the external input/outputterminal 64 provided on the control substrate 32 externally protrudesvia a through hole (not shown) provided in the lid 72.

By contrast, the external connection terminals OT1 of the sensor signalterminal 200 and the driving terminal 220 are configured to be cut so asto be housed in the case 36 and not to protrude from the case 36.Accordingly, only the front end portion of the external input/outputterminal 64 and a front end portion of a main electrode terminal 56embedded in a side wall of the case 36 protrude from the case 36, sothat an IPM can be obtained with ease.

While FIG. 10 shows a case where the main electrode terminal 56 embeddedin the side wall of the case 36, and the external connection terminalOT1 and the relay terminal RT1 are configured to be a press-fitterminal, the terminals may be configured to be a solder terminal.

Here, on the top of the IPM 700, a user PCB 50 is mounted, and the frontend portion of the external input/output terminal 64 and the front endportion of the main electrode terminal 56 are inserted into throughholes (not shown) of the user PCB 50 and then bonded, thereby connectingthe IPM 700 and the user PCB 50. However, since the external connectionterminals OT1 of the sensor signal terminal 200 and the driving terminal220 are cut so as to be housed in the case 36, the terminals are notconnected to the user PCB 50.

FIG. 11 shows a plan view of a user PCB 51 seen from above. As shown inFIG. 11, the user PCB 51 is provided with a through hole TH1 providedcorresponding to an arrangement position of the external input/outputterminal 64, and a through hole TH2 provided corresponding to anarrangement position of the main electrode terminal 56. The throughholes TH1 and TH2 each include a plurality of holes provided in line.

In such a configuration, for electrically connecting an electric partprovided not at the top of the IPM 700 with, for example, the throughhole TH1, because no obstacle is present therebetween, a linear wiringpattern PP1 can be provided, so that flexibility in design of the userPCB 50 such as insulation design, pattern design or the like will not bedeteriorated.

Thus, since in the core block 100 of the first preferred embodimentaccording to the present invention, both of the sensor signal terminal200 and the driving terminal 220 have a double structure which has theexternal connection terminal OT1 provided away from the inner side wallsurface of the case 36 and having the front end portion externallyprotruding from an end surface of a wall surface of the case 36, and therelay terminal RT1 having the front end portion not externallyprotruding from the case 36, at the time of configuring the IPM, it isonly necessary to cut off the unrequired external connection terminalOT1, so that the core block can be used entirely in common by an IPM, anIGBT module and a MOS transistor module to enable reduction inmanufacturing cost. Additionally, standardization of the core block 100enables reduction in a development period.

Additionally, since the core block 100 and the control substrate 32 areseparately configured, the control substrate 32 can be independentlydesigned. Therefore, at the time of changing a specification of drivingand protection operation, change of only the control substrate 32 isrequired, which makes a specification change easier as compared with acase where design change of the entire IPM is made at the time ofchanging a specification.

Second Preferred Embodiment

FIG. 12 is a sectional view showing a configuration of a core block 100Aof a second preferred embodiment according to the present invention. InFIG. 12, the same components as those of the IPM 70 described withreference to FIG. 2 are given the same reference codes to omitdescription of an overlapping part.

As shown in FIG. 12, in the core block 100A, neither a sensor signalterminal 200 nor a driving terminal 220 is provided, and a case 36 isonly provided with a terminal engaging portion TE for attaching thesensor signal terminal 200 and the driving terminal 220. Additionally, abonding wire for signal wiring for connecting a power device 46 with thesensor signal terminal 200 and the driving terminal 220 is not providedeither.

Thus, when an IGBT module or a MOS transistor module is configured usingthe core block 100A, as shown in FIG. 13, attaching an externalconnection terminal OT2 (first terminal) to the terminal engagingportion TE to use the same as the sensor signal terminal 200 and thedriving terminal 220 enables input/output of driving power and a signalto/from the outside.

Specifically, attaching, to the terminal engaging portion TE, theexternal connection terminal OT2 which has a length that enables a frontend portion thereof to externally protrude from an end surface of a wallsurface of the case 36, and providing a bonding wire for signal wiring60 which connects a terminal pad TP and the power device 46 results inelectrically connecting the external connection terminal OT2 and thepower device 46, thereby making it possible to obtain an IGBT modulewith ease.

Additionally, when an IPM is configured using the core block 100A, asshown in FIG. 14, a relay terminal RT2 (second terminal) is attached tothe terminal engaging portion TE to be used as the sensor signalterminal 200 and the driving terminal 220. Then, providing the bondingwire for signal wiring 60 which connects the terminal pad TP and thepower device 46 results in electrically connecting the relay terminalRT2 and the power device 46, thereby making it possible to obtain an IPMwith ease.

Here, FIG. 15 shows one example of a configuration of the terminalengaging portion TE and the relay terminal RT2. As shown in FIG. 15, aplurality of the terminal engaging portions TE are provided in aterminal block TB made of resin and arranged along an extensiondirection of the wall surface of the case 36. Each of the terminalengaging portions TE is configured with a groove provided in theterminal block TB so as to allow a terminal portion TT and the terminalpad TP of the relay terminal RT2 to insert therein. Inserting the relayterminal RT2 into the groove and thermally welding the same enables therelay terminal RT2 to be fixed to the terminal engaging portion TE.While the relay terminal RT2 in FIG. 15 shows one example of a solderterminal, the terminal may be a press-fit terminal. Additionally, it isapparent that the external connection terminal OT2 can be similarlyfixed.

FIG. 16 shows a configuration in which when an IPM is configured usingthe core block 100A, the relay terminal RT2 is attached to the terminalengaging portion TE, and the relay terminal RT2 is inserted into athrough hole (not shown) provided in a printed board 62 and then bonded,thereby connecting the core block 100A and a control substrate 32. Inthe IPM, no external connection terminal is required and therefore notprovided in FIG. 16.

Thus, in the core block 100A of the second preferred embodimentaccording to the present invention, since both of the sensor signalterminal 200 and the driving terminal 220 have a structure in which theexternal connection terminal OT2 and the relay terminal RT2 are attachedin conformity with a mode of a module, at the time of configuring theIPM, it is only necessary to attach the relay terminal RT2 but not theexternal connection terminal OT2, so that the core block can be usedentirely in common by an IPM, an IGBT module and a MOS transistor moduleto enable reduction in manufacturing cost. Additionally, standardizationof the core block 100A enables reduction in a development period.

The core block 100A and the control substrate 32 are configuredseparately and it is therefore apparent that a specification change ismade easier.

Third Preferred Embodiment

While the first preferred embodiment and the second preferred embodimentdescribed in the foregoing shows that the IGBT module or the MOStransistor module is configured to input/output driving power and asignal using the external connection terminal, the module can beconfigured to input/output driving power and a signal using a relayterminal.

FIG. 17 is a sectional view showing a configuration in which drivingpower and a signal are input/output using a relay terminal RT2 in a casewhere an IGBT module or a MOS transistor module is configured using acore block 100A.

Specifically, as shown in FIG. 17, the core block 100A is configuredsuch that the relay terminal RT2 is attached to a terminal engagingportion TE, and the relay terminal RT2 is inserted into a through hole(not shown) provided in a printed board 621 configuring an internalwiring substrate 321 and then bonded, thereby connecting the core block100A and the internal wiring substrate 321. The internal wiringsubstrate 321 includes the printed board 621 on which an internal wiringpattern not shown is provided. Additionally, on the printed board 621,an external input/output terminal 641 is provided which is electricallyconnected to the relay terminal RT2 by the internal wiring pattern.Accordingly, a power device 46 is electrically connected to the externalinput/output terminal 641 via a bonding wire for signal wiring 60, therelay terminal RT2 and the internal wiring pattern, thereby making itpossible to input/output driving power and a signal to/from the outside.

The external input/output terminal 641 can be provided at an arbitraryposition of the printed board 621 to resultantly increase flexibility indesign of the external input/output terminal 641. Additionally, FIG. 18shows a configuration in which in a case where an IPM is configuredusing the core block 100A, the relay terminal RT2 is attached to theterminal engaging portion TE, and the relay terminal RT2 is insertedinto a through hole (not shown) provided in a printed board 62 and thenbonded, thereby connecting the core block 100A and a control substrate32. Since no external connection terminal is required in the IPM, theterminal is not provided in FIG. 18. As a matter of course, a positionof the external input/output terminal 64 provided on the printed board62 can be arbitrarily set, and an increase in flexibility of design ofthe external input/output terminal 64 leads to an increase inflexibility of design of a user PCB arranged in a further upper part.

While FIG. 17 shows an example where the IGBT module or the MOStransistor module is configured using the core block 100A, the internalwiring substrate 321 is similarly applicable to a case where the IGBTmodule or the MOS transistor module is configured using the core block100 of the first preferred embodiment as described with reference toFIG. 8.

Modification 1

FIG. 19 discloses a configuration in which a case 36 is filled with aresin material to seal an insulating substrate 42, a power device 46mounted on the insulating substrate 42 and the like with a resin RS in acase where the IGBT module or the MOS transistor module is configuredusing a core block 100A.

Additionally, FIG. 20 discloses a configuration in which the case 36 isfilled with a resin material to seal not only the insulating substrate42, the power device 46 mounted on the insulating substrate 42 and thelike but also a relay terminal RT2 and a control substrate 32 with theresin RS in a case where the IPM is configured using the core block100A.

Thus, sealing the case 36 with the resin RS obtains a solid with someextent of strength as a result of solidification of the resin RS,thereby enabling the configuration in the case 36 to be protected. Inparticular, deformation of an external connection terminal OT2 and therelay terminal RT2 due to external stress can be prevented to enablereduction in generation of defective products caused by deformation ofthe relay terminal RT2 after shipping of the products. This effect isconspicuous in particular when the relay terminal RT2 is configured witha press-fit terminal.

While the example of use of the core block 100A has been described inFIG. 19 and FIG. 20, sealing the case 36 with the resin RS is alsoeffective when the core block 100 of the first preferred embodiment asdescribed with reference to FIG. 8 is used.

Modification 2

FIG. 21 discloses a configuration in which a case 36 is filled with aresin material and an opening portion of the case 36 is covered with alid CV1 in a case where an IGBT module or a MOS transistor module isconfigured using a core block 100A.

As shown in FIG. 21, an external connection terminal OT2 extendingthrough the resin RS to protrude from the case 36 and a main electrodeterminal 56 externally protruding from an end surface of a wall surfaceof the case 36 externally protrude from an upper surface of the lid CV1via a through hole (not shown) provided in the lid CV1.

FIG. 22 discloses a configuration in which the case 36 is filled with aresin material and also the opening portion of the case 36 is coveredwith the lid CV1 in a case where the IPM is configured using the coreblock 100A.

As shown in FIG. 22, an external input/output terminal 64 extendingthrough the resin RS to protrude from the case 36 and a main electrodeterminal 56 externally protruding from the end surface of the wallsurface of the case 36 externally protrude from an upper surface of thelid CV1 via the through hole (not shown) provided in the lid CV1 made ofresin.

It is here configured such that the lid CV1 is provided so as to coverthe opening portion of the case 36 before filling the case 36 with aresin material, and the resin material is introduced from a resinintroduction hole (not shown) provided in the lid CV1. As a result, withthe external connection terminal OT2 and the external input/outputterminal 64 inserted in the through holes (not shown) provided in thelid CV1, the resin material is introduced, thereby making it possible toprevent deformation of the external connection terminal OT2 and theexternal input/output terminal 64 due to external stress caused at thetime of the introduction of the resin material.

Although FIG. 21 shows a configuration in which the external connectionterminal OT2 and the main electrode terminal 56 extend through the lidCV1, in this case, positions of the external connection terminal OT2 andthe main electrode terminal 56 are defined by the configuration of thecore block 100A.

However, positions of the external connection terminal OT2 and the mainelectrode terminal 56 can be substantially arbitrarily set by making aconstitution like that in a lid CV2 shown in FIG. 23 such that with acontrol terminal 15 and an electrode terminal 16 internally contained,the external connection terminal OT2 is connected to one end of thecontrol terminal 15 and the other end of the control terminal 15protrudes from an arbitrary position on an upper surface of the lid CV2,and the main electrode terminal 56 is connected to one end of theelectrode terminal 16 and the other end of the control terminal 15protrudes from an arbitrary position on the upper surface of the lidCV2.

In this case, it is assumed that the external connection terminal OT2and the main electrode terminal 56 are each configured with a press-fitterminal and one end of each of the control terminal 15 and theelectrode terminal 16 is provided with a through hole through which thepress-fit terminal is inserted.

Here, a configuration of a press-fit terminal will be described withreference to FIG. 24, with the external connection terminal OT2 as anexample. As shown in FIG. 24, the press-fit terminal has a needle eyeshape so as to make a front end of a press-fit portion PF have springcharacteristic, and insertion of the terminal into a through hole THnarrower than the press-fit portion PF enables contact to be kept withan inner wall of the through hole TH.

Additionally, the through hole TH provided in the control terminal 15 isconfigured such that an inner surface and a periphery thereof arecovered with, for example, copper plating to form a plated layer PL1,and further a surface of the plated layer PL1 is covered with, forexample, tin plating to form a plated layer PL2, thereby reducing anelectric resistance with the press-fit portion PF.

The present invention allows the respective preferred embodiments to befreely combined or appropriately modified or omitted within the scope ofthe invention.

While the invention has been shown and described in detail, theforegoing description is in all aspects illustrative and notrestrictive. It is therefore understood that numerous modifications andvariations can be devised without departing from the scope of theinvention.

What is claimed is:
 1. A semiconductor device comprising: a powerdevice; a sensor which measures a physical state of said power device totransmit a signal according to said physical state; a main electrodeterminal through which a main current of said power device flows; asensor signal terminal connected to said sensor for receiving a signalfrom said sensor; a driving terminal which receives driving power fordriving said power device; and an open bottomed case which houses saidpower device, said sensor, said main electrode terminal, said sensorsignal terminal and said driving terminal, wherein said sensor signalterminal and said driving terminal each have a first terminal and asecond terminal which are provided away from an inner side wall surfaceof said case, said first and second terminals electrically conductingwith each other to form a double structure.
 2. The semiconductor deviceaccording to claim 1, wherein said first terminal has a length thatallows a front end portion thereof to externally protrude from an uppersurface of said case and inputs/outputs said signal and said drivingpower to/from the outside, and said second terminal has a length thatfails to allow a front end portion thereof to externally protrude fromthe upper surface of said case.
 3. The semiconductor device according toclaim 1, further comprising a control substrate provided at the top ofsaid power device in said case for controlling drive of said powerdevice, wherein said first terminal and said second terminal each have alength that fails to allow a front end portion thereof to externallyprotrude from an upper surface of said case, and said second terminalhas a length that allows the front end portion thereof to be connectedto said control substrate and inputs/outputs said signal and saiddriving power to/from said control substrate.
 4. The semiconductordevice according to claim 1, wherein said case is filled with resin. 5.The semiconductor device according to claim 2, wherein said case isfilled with resin and further includes a lid provided so as to cover theupper surface of said case, and said first terminal extends through saidlid to externally protrude from the upper surface of said lid.
 6. Thesemiconductor device according to claim 3, wherein said controlsubstrate has an external input/output terminal with a length thatallows a front end portion thereof to externally protrude from the uppersurface of said case, said case is filled with resin and furtherincludes a lid provided so as to cover the upper surface of said case,and said external input/output terminal extends through said lid toexternally protrude from the upper surface of said lid.
 7. Thesemiconductor device according to claim 2, wherein said case is filledwith resin and further includes a lid provided so as to cover the uppersurface of said case, said main electrode terminal has a length thatallows a front end portion thereof to externally protrude from the uppersurface of said case, said lid contains a control terminal and anelectrode terminal, one end of said control terminal is connected tosaid first terminal and the other end of said control terminalexternally protrudes from the upper surface of said lid, one end of saidelectrode terminal is connected to said main electrode terminal and theother end of said electrode terminal externally protrudes from the uppersurface of said lid, and said main electrode terminal and said firstterminal include a press-fit terminal.
 8. A semiconductor devicecomprising: a power device; a sensor which measures a physical state ofsaid power device to transmit a signal according to said physical state;a main electrode terminal through which a main current of said powerdevice flows; a sensor signal terminal connected to said sensor; adriving terminal which receives driving power for driving said powerdevice; and an open bottomed case which houses said power device, saidsensor, said main electrode terminal, said sensor signal terminal andsaid driving terminal, wherein said sensor signal terminal and saiddriving terminal each have a first terminal which is provided away froman inner side wall surface of said case and has a length that allows afront end portion thereof to externally protrude from an upper surfaceof said case or a second terminal which has a length that fails to allowa front end portion thereof to externally protrude from the uppersurface of said case, and said first and second terminals are attachedto a terminal engaging portion provided in said case.
 9. Thesemiconductor device according to claim 8, wherein said first terminalis attached to said terminal engaging portion to input/output saidsignal and said driving power to/from the outside.
 10. The semiconductordevice according to claim 8, further comprising a control substrateprovided at the top of said power device in said case for controllingdrive of said power device, wherein said second terminal is attached tosaid terminal engaging portion, and said second terminal has a lengththat allows the front end portion thereof to be connected to saidcontrol substrate and inputs/outputs said signal and said driving powerto/from said control substrate.
 11. The semiconductor device accordingto claim 8, further comprising an internal wiring substrate having anexternal input/output terminal which is provided at the top of saidpower device in said case and has a length that allows a front endportion thereof to externally protrude from the upper surface of saidcase and a wiring pattern connected to said input/output terminal,wherein said second terminal is attached to said terminal engagingportion, and said second terminal has a length that allows the front endportion thereof to be connected to said internal wiring substrate andinputs/outputs said signal and said driving power to/from the outsidevia said wiring pattern and said external input/output terminal.
 12. Thesemiconductor device according to claim 8, wherein said case is filledwith resin.
 13. The semiconductor device according to claim 9, whereinsaid case is filled with resin and further includes a lid provided so asto cover the upper surface of said case, and said first terminal extendsthrough said lid to externally protrude from the upper surface of saidlid.
 14. The semiconductor device according to claim 10, wherein saidcontrol substrate has an external input/output terminal with a lengththat allows a front end portion thereof to externally protrude from theupper surface of said case, said case is filled with resin and furtherincludes a lid provided so as to cover the upper surface of said case,and said external input/output terminal extends through said lid toexternally protrude from the upper surface of said lid.
 15. Thesemiconductor device according to claim 9, wherein said case is filledwith resin and further includes a lid provided so as to cover the uppersurface of said case, said main electrode terminal has a length thatallows a front end portion thereof to externally protrude from the uppersurface of said case, said lid contains a control terminal and anelectrode terminal, one end of said control terminal is connected tosaid first terminal and the other end of said control terminalexternally protrudes from the upper surface of said lid, one end of saidelectrode terminal is connected to said main electrode terminal and theother end of said electrode terminal externally protrudes from the uppersurface of said lid, and said main electrode terminal and said firstterminal include a press-fit terminal.